| Capabilities |
| |
Technology Guidelines Chart |
| |
| Parameter |
Present Capabilities |
Capabilities (2010) |
| Layers(Min/Max) |
|
|
| Normal Board |
1-22 |
1-24 |
| |
|
|
| Special Process
|
Present Capabilities |
Capabilities (2010) |
| HDI |
Yes |
Yes |
| 100% filled via in pad
|
Yes |
Yes |
| Embedded Capacitor |
No |
Yes |
| Embedded Resistor |
No |
Yes |
| Blind Via
|
Yes |
Yes |
| Buried Via
|
Yes |
Yes |
| |
|
|
| Material
|
Present Capabilities |
Capabilities (2010) |
| FR4(Normal Tg)
|
Yes |
Yes |
| FR4(High Tg)
|
Yes |
Yes |
| Bergquist |
Yes |
Yes |
| CAF-Resistance
|
Yes |
Yes |
| |
|
|
| InnerLayer Copper
|
Present Capabilities |
Capabilities (2010) |
| Copper Foil Weight
|
0.5-6 Oz
|
0.5-6 Oz
|
| Min Line/Space
|
4/4 mil
|
3/3 mil
|
| Limited Volume
|
3/3 mil
|
3/3 mil
|
| Line Width Tol.
|
±10%
|
±8%
|
| |
|
|
| OuterLayer Copper |
Present Capabilities |
Capabilities (2010) |
| Copper Foil Weight
|
1/3-6 Oz
|
1/3-6 Oz
|
| Min Line/Space
|
4/4 mil
|
3/3 mil
|
| Limited Volume
|
3/3 mil
|
3/3 mil
|
| Line Width Tol.
|
±10%
|
±8%
|
| |
|
|
| Dielectric Thickness
|
Present Capabilities |
Capabilities (2010) |
| Min Overall
Board Thickness |
10 mil |
8 mil |
| Max Overall
Board Thickness |
189 mil |
189 mil |
| Min Overall Tol.
|
±10% |
±10% |
| Min Dielectric spacing
|
3 mil |
3 mil |
Min Dielectric Tol.
|
±10% |
±10% |
| Layer-to-Layer
|
4 mil |
3 mil |
| |
|
|
| Drilled Hole |
Present Capabilities |
Capabilities (2010) |
Min Drilled Diameter |
10 mil |
8 mil |
Max Drilled Diameter |
264 mil |
264 mil |
Max Aspect Ratio |
10:01 |
12:01 |
PTH Dia. Tol.
|
±3 mil(Tighest:±2 mil) |
±3 mil(Tighest:±2 mil) |
NPTH Dia. Tol.
|
±1 mil |
±1 mil |
Hole-to-Hole Accuracy
|
±2 mil |
±2 mil |
| |
|
|
| PCB Routing |
Present Capabilities |
Capabilities (2010) |
| Edge-to-Edge Tol.
|
±5 mil |
±4 mil |
| Edge-to-Datum Tol.
|
±5 mil |
±4 mil |
| Min Internal Radius
|
15 mil |
15 mil |
| Max Routed Hole Dia.
|
1.25" |
1.25" |
| Max Routed Hole Tol.
|
±4 mil |
±4 mil |
| Min Routed Hole Dia
|
32 mil |
32 mil |
| Min Routed Hole Tol.
|
±3 mil |
±3 mil |
| |
|
|
| Scoring |
Present Capabilities |
Capabilities (2010) |
Min. Web Thickness
|
Per Customer Requirement
|
Per Customer Requirement
|
Scoring Angles
|
30°,45°,60°
|
30°,45°,60°
|
Web Thickness Tol.
|
±4 mil
|
±3 mil
|
| |
|
|
| Edge Bevels
|
Present Capabilities |
Capabilities (2010) |
Angles
|
20°,30°,45° |
20°,30°,45° |
Angles Tol.
|
±5° |
±5° |
Min/Max Depth
|
15/75 mil |
15/75 mil |
| |
|
|
| Solder Mask |
Present Capabilities |
Capabilities (2010) |
| Nominal Thickness Over Trace |
0.4 mil |
0.6 mil |
| Registration Tol. |
±3 mil |
±3 mil |
| Space Required for Mask Between Pads |
8 mil |
8 mil |
| Available Colors |
Green/Black/Blue/ Yellow/Red |
Green/Black/Blue/ Yellow/Red |
| Via Plugging |
Yes |
Yes |
| |
|
|
| Silk Screen |
Present Capabilities |
Capabilities (2010) |
Type
|
Epoxy |
Epoxy |
| Colors |
White/Yellow/Black |
White/Yellow/Black |
Min Line Width |
6 mil |
5 mil |
Min Accuracy |
6 mil |
5 mil |
| |
|
|
| Conductor Surface Finishes
|
Present Capabilities |
Capabilities (2010) |
HASL
|
3-38 um
|
3-38 um
|
OSP
|
0.3-0.6 um
|
0.3-0.6 um
|
ENIG
|
Au:0.03-0.15 um
|
Au:0.03-0.15 um
|
Flash Gold
|
1-6 U"
|
1-6 U"
|
Immersion Tin
|
Yes
|
Yes
|
Immersion Silver
|
Yes
|
Yes
|
Lead Free HASL
|
Yes
|
Yes
|
Carbon Ink
|
Yes
|
Yes
|
Peelable Soldermask
|
Yes
|
Yes
|
| |
|
|
| Electrical Test
|
Present Capabilities |
Capabilities (2010) |
Impedance |
Yes |
Yes |
Max Hi-Pot Voltage |
2500 V |
2500 V |
Max Continuity Voltage |
250 V |
250 V |
Max Isolation Resistance |
20 M ohms |
20 M ohms |
Min Continuity Resistance |
10 ohms |
10 ohms |
| |
|
|
| Warp & Twist
|
Present Capabilities |
Capabilities (2010) |
Warp & Twist |
0.70% |
0.70% |
| |
|
|
|
| |
| |
|
|
|
|
| Copyright 2008 Circuitronix LLC. All rights reserved. |
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